The application and development of small laser engraving machine in the LED industry?

       Small laser engraving machine cutting is a kind of laser emitted by a high-energy laser. Focusing through the lens, it achieves a high laser power density at the focus. The high-power density laser illuminates the workpiece point, which will generate local high temperature and instantaneous vaporization of the workpiece material. , melting, and controlling the platform to drive the movement of the workpiece, the formation of a new cutting non-contact mode.



      Laser processing has the advantages of concentrated energy, small heat-affected area, no need to touch the workpiece, no contamination of the workpiece and electromagnetic interference, and the laser beam is easy to focus, guide and facilitate automatic control. It has a wide range of applications in the semiconductor, LED and photovoltaic solar fields.



Development of laser cutting technology for Led wafers



1. Generation and generation of the first generation of UV laser wafer cutting equipment



      When sapphire is used as a substrate material, it is widely used in LED chip production. Traditional knives can not meet the cutting requirements. In the United States, the company, 355nm several manufacturers, 266nm and other short-wavelength nanosecond laser dicing, sapphire wafer processing, The small and narrow cutting method required to solve the difficulties and sapphire cutting LED industry, and the large-scale production of sapphire substrate LEDs, can guarantee high quality cutting.



feature:



Laser power is around 1W



Scribe speed 10-20mm/s



Production capacity 1--3pcs/h



Laser pulse nanosecond



Cutting effect: the opening is narrow, the efficiency is low, the laser pulse width is long, and the melting phenomenon is obvious.



2. Development of a new generation of UV laser cutting equipment



      With the development and scale of blue-green LED chips, the requirements for cutting equipment for small laser engraving machines are getting higher and higher. This also forces laser equipment suppliers to upgrade their equipment. At the same time, due to the development of laser technology and the decline in prices, domestic laser dicing equipment has begun to enter the market. A new generation of UV laser dicing equipment has been produced. Its productivity has increased to 3-5 times that of the first generation of dicing machines, with a maximum of 15 pieces per hour.



feature:



Laser power 2--3W



Cutting speed 100--120mm/s



Production capacity 10--15pcs/h



Laser pulse width picosecond



Cutting effect: wide opening, high cutting efficiency, short laser pulse, obvious gasification, more suitable for sidewall corrosion process.



3. The generation and development of picosecond laser wafer cutting equipment



      Laser crystal engraving technology is turned on, and then some people apply this technology to sapphire cutting, which has made new developments in laser cutting, but the brightness of the chip is greatly improved compared with the traditional cutting process. Now almost all chip manufacturers Using picosecond cutting equipment, it is worth mentioning that the market's main strength is domestic equipment, breaking the mysterious monopoly of disco and private picosecond cutting equipment.



feature:


Laser power 1--3W



Scribe speed ≦600mm/s

Capacity 16pcs/h



Laser pulse picosecond



Can increase the brightness of the chip by about 5% -10%


Cutting effect: directly affects the material, fast speed, high productivity and less molten material.